YASKAWA dual arm vacuum wafer transfer robot

Characteristics of Yaskawa Vacuum Wafer Handling Robot:

1. Suitable for wafer handling inside vacuum chambers;

2. Fork materials: CFRP (carbon fiber), aluminum alloy, high-purity ceramics and other optional materials;

3. Equipped with motion monitor;

4. The S-curve acceleration and deceleration control method can transport semiconductor wafers at high speed and high precision;

5. Use magnetic fluid sealing devices at arm joints;

6. Vacuum sealing: magnetic fluid sealing device and corrugated tube;

7. Install a 5 μ m level filter on the exhaust port inside the arm.