YASKAWA dual arm vacuum wafer transfer robot
Characteristics of Yaskawa Vacuum Wafer Handling Robot:
1. Suitable for wafer handling inside vacuum chambers;
2. Fork materials: CFRP (carbon fiber), aluminum alloy, high-purity ceramics and other optional materials;
3. Equipped with motion monitor;
4. The S-curve acceleration and deceleration control method can transport semiconductor wafers at high speed and high precision;
5. Use magnetic fluid sealing devices at arm joints;
6. Vacuum sealing: magnetic fluid sealing device and corrugated tube;
7. Install a 5 μ m level filter on the exhaust port inside the arm.